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Machinable Aluminum Nitride BAN

BAN combines Aluminum Nitride with Boron Nitride, a hybrid machinable Aluminum Nitride ceramic with excellent thermal conductivity, high strength, and resistance to thermal shock. Innovacera provides BAN, and it has very similar properties to SHAPAL material. SHAPAL is a trademark of Tokuyama Corporation.   These ceramics are used in various industries, including electronics, semiconductor manufacturing, aerospace, automotive and medical. BAN ceramics have properties that make them suitable for applications such as heat sinks, heater substrates, semiconductor processing components, and optical equipment.   Material Advantages: High mechanical strength. High thermal conductivity. Low thermal expansion. Low dielectric loss. Excellent electrical insulation. High corrosion resistance–non-wetted by molten metals. Excellent Machinabilit–BAN can be machined to high-precision complex shapes. It has excellent sealing ability to vacuum and hasn't given off much gas. High-frequency wave properties, allow visible infra-red light to pass through easily. Material Properties:   Properties Units BAN Main Composition / BN+ALN Color / Greyish- Green Density g/cm3 2.8~2.9 Three-Point Bending Strength MPa 90 Compressive Strength MPa 220 Thermal Conductivity W/m·k 85 Thermal Expansion Coefficient (20-1000℃) 10-6/K 2.8 Max Using Temperature In Atmosphere ℃ 900 In Inactive Gas ℃ 1750 In High Vacuum ℃ 1750     Applications Heat sinks Vacuum components Components where...

Why is Machining Aluminum Nitride Ceramics Challenging?

Aluminum nitride ceramics, composed mainly of aluminum nitride, possess remarkable properties such as high thermal conductivity, excellent insulation, and low dielectric constant. The crystal structure of aluminum nitride consists of tetrahedral units forming a covalent-bonded compound, exhibiting a spinel-type structure within the hexagonal crystal system. With a chemical composition of 65.81% aluminum and 34.19% nitrogen, and a density of 3.261g/cm3, aluminum nitride ceramics appear white or gray-white, with single crystals being transparent and colorless. These ceramics boast a sublimation decomposition temperature of 2450°C under standard pressure, making them ideal for high-temperature applications. Additionally, their coefficient of thermal expansion ranges from 4.0 to 6.0 * 10^-6/°C, and their polycrystalline form exhibits a thermal conductivity of up to 260W/(m·K), surpassing that of aluminum oxide by 5-8 times, thus demonstrating excellent resistance to thermal shock up to 2200°C. Furthermore, aluminum nitride showcases resistance to corrosion from molten aluminum and other metals, particularly demonstrating outstanding resistance against molten aluminum corrosion.     Despite the various machining methods available for aluminum nitride ceramics, precision machining often necessitates the use of CNC equipment. However, the formidable hardness of aluminum nitride, exceeding 11 GPa, renders conventional metal machining techniques ineffective.     Firstly, machining aluminum nitride ceramics...

The use of Boron Nitride (BN) Ceramics

Basic information about Boron Nitride (BN) Boron nitride (BN) is a thermally and chemically resistant refractory material, compound of boron and nitrogen. It exists in various crystalline forms that are isoelectronic to a similarly structured carbon lattice. The hexagonal form corresponding to graphite is the most stable and soft among BN polymorphs. With excellent thermal and chemical stability, boron nitride ceramics are used in high-temperature equipment and metal casting, which  has potential use in nanotechnology. In the neutral reducing atmosphere, Boron Nitride's heat resistance can be to 2000℃, the use temperature in nitrogen and argon can reach 2800℃, the stability is poor in the oxygen atmosphere below 1000℃. The expansion coefficient of hexagonal boron nitride is equivalent to that of quartz, but the thermal conductivity is ten times that of quartz. Boron Nitride (BN) Material Available: 1. 99% BN 2. 99.7% BN 3. BN + AL 4. BN + Si 5. BN + SiC 6. BN + Zirconia 7. BN + ALN The Following are the Characteristics of Different Boron Nitride (BN) Materials: The Main Use of Boron Nitride Ceramics: 1. Vacuum high temperature equipment electrode insulation (99BN, BN+AL) Advantage: high temperature resistance 2000 degrees, good thermal shock resistance, high electrical breakdown strength (3-4 times...

Classification and Characteristics of Ceramic Substrates Commonly Used in Electronic Packaging

There are many kinds of electronic packaging substrates, and the commonly used substrates are mainly divided into plastic packaging substrates, metal packaging substrates and ceramic packaging substrates. Plastic packaging materials usually have low thermal conductivity, poor reliability, and are not suitable for high requirements. Metal packaging materials have a high thermal conductivity, but the general thermal expansion coefficient does not match, and the price is expensive. Ceramic substrates are commonly used for electronic packaging. Compared with plastic and metal substrates, ceramic substrates have the following advantages: 1. Good insulation performance, high reliability; 2. Low dielectric coefficient, high frequency performance; 3. Low expansion coefficient, high thermal conductivity; 4. Good air tightness, stable chemical properties, and a strong protective effect on electronic systems.   Therefore, it is suitable for aviation, aerospace, military and other high reliability, high frequency, high temperature resistance, good air tightness product packaging. Ultra-small chip electronic components are widely used in mobile communications, computers, household appliances, automotive electronics and other fields, and their carrier materials are usually packaged with ceramic substrates.   At present, the commonly used ceramic substrate materials for electronic packaging are alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), silicon carbide (SiC), boron nitride (BN), beryllium...

Characteristics and Applications of Aluminum Nitride Ceramics

Aluminum nitride ceramics have excellent thermal conductivity, reliable electrical insulation, low dielectric constant and dielectric loss, non-toxic and matched with the coefficient of thermal expansion of silicon, a new generation of highly integrated semiconductor substrate and the ideal packaging material for electronic devices, but also can be used for heat exchangers, piezoelectric ceramics and thin films, thermally conductive filler. AlN ceramics are used as copper-clad substrates, electronic packaging materials, ultra-high-temperature device packaging materials, high-power device platform materials, high-frequency device materials, thin-film materials for sensors, materials for optical electronics, coatings and functional enhancement materials.   Application:   1. Heat dissipation substrate and electronic device packaging Ideal for packaging hybrid power switches and microwave vacuum tube housings, as well as substrates for large-scale integrated circuits.   2. Structural Ceramics AIN ceramics are heat and erosion resistant and can be used to make crucibles, Al evaporation dishes, semiconductor electrostatic chucks, and other high temperature corrosion resistant parts.   3. Functional Materials Aluminum nitride can be used to make high-frequency, high-power devices that can be used at high temperatures or in the presence of radiation, such as high-power electronics and high-density solid-state memory. High-purity AlN ceramics are transparent and have excellent optical properties, which,...

Aluminum Nitride Applications & Features Is Outstanding And Demand Is Growing

Aluminum nitride is a covalently bonded compound with a hexagonal brazingite structure. Aluminum nitride has a series of excellent features as below: Excellent thermal conductivity, Reliable electrical insulation, Low dielectric constant, Dielectric loss, Non-toxic, Has a thermal expansion coefficient that matches silicon. Aluminum nitride has become a material of great concern in the electronics field due to its excellent thermal conductivity and thermal expansion coefficient matching that of silicon. ALN material is not only an ideal material for new generation heat dissipation substrates and electronic device packaging, but also can be used in heat exchangers, piezoelectric ceramics and films, thermal conductive fillers, etc., with broad application prospects. The crystal structure of AlN determines its excellent thermal conductivity and insulation properties. According to the study "Research on Tape Casting and Sintered Body Properties of Aluminum Nitride Ceramics", due to the small atomic weight of the two elements that make up the AlN molecule, the crystal structure is relatively simple and has good harmonicity, and the formed Al-N bond The bond length is short, the bond energy is large, and the resonance of the covalent bond is conducive to the phonon heat transfer mechanism, making the AlN material superior to general non-metallic...

Aluminum Nitride Ceramic Part Typical Applications

Compared with other ceramic materials, AlN has a thermal expansion coefficient that matches silicon and excellent thermal conductivity, which makes it more suitable for use in the electronics industry. Aluminium Nitride Ceramic Material Properties is as bleolw. Properties Unit Value Color -  Dark Gray Main Content % 96% ALN Bulk Density g/cm3 3.335 Water Absorption % 0 Flexural Strength MPa 382.7 Dielectric Constant MHz 8.56 Coefficient Linear Thermal Expansion /℃，5℃/min, 20~300℃ 2.805x10-6 Thermal Conductivity 30 Degree Celsius ≥170 Chemical Durability mg/cm2 0.97 Thermal Shocking Resistance - No cracks Volume Resistivity 20 Degree Celsius (Ω·cm) 1.4x1014 Dielectric Strength KV/mm 18.45 Surface Roughness Ra μm 0.3-0.5 Camber Length ‰ ≤2 Aluminum nitride can also be used in heat exchangers, crucibles, protective tubes, casting molds, piezoelectric ceramics and films, thermally conductive fillers, etc. Below is some application of Aluminum nitride ceramic components. 1. Heat dissipation substrate and electronic device packaging Heat dissipation substrates and electronic device packaging are the main applications of AlN ceramics. Aluminum nitride ceramics have excellent thermal conductivity, thermal expansion coefficient close to silicon, high mechanical strength, good chemical stability, and are environmentally friendly and non-toxic. It is considered an ideal material for a new generation of heat dissipation substrates and electronic device packaging, and is very suitable for hybrid power switches. It is a material for packaging and microwave vacuum tube packaging shells, and is...

Exploring the Thermal Management Capabilities of Ceramic Circuit Substrates

With the continuous development and advancement of electronic devices, high power density and high temperature have become one of the important challenges faced by modern electronic systems. Thermal management is a key factor in maintaining the reliability and performance stability of electronic devices. In this regard, this article will explore the thermal management capabilities of ceramic circuit substrates, introduce their applications in high-temperature environments, and discuss related technological advances and solutions. Thermal conductivity of ceramic circuit substrates: Ceramic materials have good thermal conductivity. In comparison, traditional organic substrate materials have low thermal conductivity. Common ceramic circuit substrate materials, such as aluminum nitride (AlN) and silicon nitride (Si3N4), have high thermal conductivity, respectively 170-200 W/(m·K) and 80-140 W/(m·K ). This allows the ceramic circuit board to dissipate heat more effectively, improving thermal management capabilities. (INNOVACERA provides a variety of high-quality ceramic substrate materials). Thermal transfer and thermal design: In high power density applications, thermal transfer and thermal design are critical. The thermal conductivity properties of ceramic circuit substrates provide designers with greater flexibility and possibilities. Through reasonable heat dissipation design, such as adding heat sinks or thermal vias, the thermal management capabilities of ceramic circuit substrates can be effectively improved, heat...

Ceramic Substrates For Power Modules

Ceramic substrates are materials with unique thermal, mechanical, and electrical properties that make them ideal for demanding power electronics applications, typically used in Power Modules. The most recent applications of power modules are for electric vehicles (EVs) and hybrid electric vehicles (HEVs), call for higher voltage and power from smaller circuits, requiring circuit materials capable of providing high voltage isolation with the efficient dissipation of heat from densely packed semiconductor devices such as IGBTs and MOSFETs. DBC and AMB Ceramic Substrates for Power Modules are connection components in which copper plates are bonded to each surfaces of a ceramic plate. These ceramic substrates are with a high thermal conductivity and a excellent electric conductivity of copper and a high insulation property. The high electrical conductivity of copper supports high current; the excellent dielectric properties of the ceramic substrates enable the high isolation needed for densely packed circuits in power modules. The CTE of ceramic substrates aligns more closely with that of the metal traces on the substrate and the components soldered to the substrate. That helps minimize stresses that can lead to component and solder joint fractures. Ceramic substrates are implying copper layers on the ceramic plates, then etching with...

Hot-Pressed Aluminum Nitride

About Hot-Pressed Aluminum Nitride (AlN) Hot pressed aluminum nitride ceramics are sintered by vacuum hot pressing. The aluminum nitride purity is up to 99.5%(without any sintering additives), and density after hot pressing reaches 3.3g/cm3, it also has excellent thermal conductivity and high electrical insulation. The thermal conductivity can be from 90 W/(m·k) to 210 W/(m·k). The aluminum nitride ceramic mechanical strength and hardness of the product after high temperature and high pressure are better than those of the tape casting process, dry pressing and cold isostatic press method. Hot pressed aluminum nitride ceramics have high temperature resistance and corrosion resistance, and will not be eroded by various molten metals and molten hydrochloric acid. Typical Application of Aluminum Nitride (AlN) Cooling cover and magnetic resonance imaging equipment As the substrate of high-frequency surface acoustic wave device, large-size and high-power heat dissipation insulating substrate Electrostatic chuck and heating disk for semiconductor and integrated circuit Infrared and microwave window materials Crucible for compound semiconductor single crystal growth Target of high-purity aluminum nitride film Features High thermal conductivity Expansion coefficient can match with semiconductor silicon chips High insulation resistance and voltage withstand strength Low dielectric constant and low dielectric loss High mechanical strength Maximum Size...
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