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Aluminum Nitride Properties And Applications

Aluminum nitride has good oxidation resistance, chemical resistance, thermal shock resistance, mechanical strength, low dielectric constant, thermal expansion coefficient similar to that of silicon crystal, and high thermal conductivity. So it is widely used in machinery and other application fields. Below are the detailed properties: Thermal property The theoretical thermal conductivity of AlN is 320W/m•K, the thermal conductivity of the prepared polycrystalline AlN is generally 100~260W/m•K, and the room temperature thermal conductivity is 10~15 times that of Al2O3, which is close to BeO ( The theoretical thermal conductivity is 350W/m K), and when the temperature is higher than 200℃, the thermal conductivity is better than that of beryllium oxide; in the range of 25~400℃, the thermal expansion coefficient of pure AIN is 4.4×10-6K- 1, similar to the thermal expansion coefficient of silicon (3.4×10-6K-1). Electrical properties The room temperature cathode rate of pure AIN is greater than 1014Ω•cm, which is a good insulating material; the dielectric constant is about 8.0 (1MHz), which is equivalent to Al2O3; the dielectric loss is 10-4 (1MHz), and the dielectric withstand voltage is 14KV •mm-1, high electromechanical coupling coefficient (0.8%), piezoelectricity and negative yield. Mechanical properties At room temperature, the Vickers hardness of dense AIN ceramics...

AIN Wafer – One Of The Most Popular Ceramic Substrate

INNOVACERA provides AlN ceramic substrate. AlN substrate is one of the most popular ceramic substrates which has excellent heat resistance, high mechanical strength, abrasion resistance, and small dielectric loss. The surface of the AlN substrate is quite smooth and has low porosity. Aluminum Nitride has higher thermal conductivity, compared to alumina substrate, It is about 7 to 8 times high. AlN substrate is an excellent electronic package material. INNOVACERA provides AlN substrate for a wide range of applications, including thin film and thick film microelectronic, high power and high-frequency circuit RF/microwave components and capacitor or resistor, contact us for more ceramic wafer product information. AlN Wafer Properties: Chemical formula AlN Color Gray Density 3.3 g/cm3 Thermal conductivity 160 ~ 190 W/m.K Thermal Expansion (x10 -6/°C) 2-3.5 Dielectric strength ≥17KV/MM Dielectric Constant (at 1MHZ) 8-10 Loss Tangent (x10 -4 @1MHZ) 2.0 Volume Resistivity ≥10^14 ohm-cm AlN Wafer Properties: Diameter Ø 16 / Ø 20 / Ø 30 / Ø40 / Ø 50 /Ø 60 / Ø 75 / Ø 80 Square size 2"x 2" / 3" x 3" / 4" x 4" / 4.5" x 4.5" Thickness 0.385 mm / 0.5 mm /0.635mm/ 1 mm Surface As fired   one side polished / two sides...

Ceramic Boron Nitride Setters For Sintering Nitride Ceramics

Due to Boron Nitride’s high purity, non-adhesive and long working life, it’s a good choice used for sintering Aluminum Nitride and Silicon Nitride substrates. And it won’t make pollution for the sintering process. Hexagonal Boron Nitride has a low expansion coefficient and high thermal conductivity, so it has excellent thermal shock resistance, and it will not be damaged even after hundreds of times of cycle use at 2000°C. The expansion coefficient of BN is equivalent to that of quartz, but the thermal conductivity is 10 times that of quartz. Features of Boron Nitride: High purity with 99.7% Quality stable in mass production No deformation in high temperature Max working temperature is over 2100°C Resist high heat shock All the features make Boron Nitride a very good material for the sintering field. Our Boron Nitride is an alternative for Denka NB-1000. The advantages for choosing us: Competitive price Short delivery time (20-35 days) Stable quality Do adjustments very quickly due to customers’ feedback on quality. The max dimension we can make: 500x500 mm

Performance required for ceramic substrates and packages

Ceramic substrates and packages are used for semiconductor packages and electronic modules, of which the speedy operation and high integration are advancing, and sensor modules, of which the high precision and high sensitivity are advancing. The performance required for these applications is as follows: · Dimensional stability and flatness · Supports various mounting forms (wire bonding, flip-chip bonding, SMT, etc.) · The coefficient of linear expansion is close to that of silicon · Small size with fine wiring · Frequency characteristic · High reliability including heat resistance and humidity resistance INNOVACERA provides below materials of ceramic substrates: 1) 96% Al2O3 Ceramic substrates 2) 99.6% Al2O3 Ceramic substrates 3) AlN Ceramic substrates 4) Si3N4 Ceramic substrates If you want to know more information, pls contact us.

Process Comparison of the Ceramic Substrate

The metallized ceramic substrate is a kind of circuit board. It has a thermal expansion coefficient close to that of semiconductors and high heat resistance. It is suitable for products with high heat generation (high-brightness LED, solar energy), and its excellent weather resistance is more suitable for harsh outdoor environments. Because it has the characteristics of lead-free, non-toxic, and good chemical stability, it will not cause harm to environmental protection, so it is more and more widely accepted by the public. Due to different processes, the ceramic substrate is mainly divided into DBC (Direct Bonded Copper), DPC (Direct Plated Copper), AMB (Active Metal Brazing), and Thick film. We will introduce each of the processes and the advantages, disadvantages of each process. DBC (Direct Bonded Copper) It is composed of the ceramic substrate, bonding layer, and conductive layer. It refers to the special process of copper foil directly bonding to alumina or aluminum nitride ceramic substrate surface at high temperature. The advantages are as below: The copper layer is thick; The processing is fast; The price is cheap; Can make multilayer; Suitable for large area consumption; High thermal conductivity; High adhesion strength; Excellent soft brazing; Excellent electrical insulation The disadvantages are...

The main application of aluminum nitride ceramics

Aluminum nitride is a new type of ceramic material with excellent comprehensive performance. It has excellent thermal conductivity and thermal shock resistance, reliable electrical insulation. Because of the liquid phase sintering and no second phase at the grain boundary, the crystal structure is very dense and has good Resistance to plasma corrosion. A series of excellent characteristics such as low dielectric constant and dielectric loss, non-toxic and thermal expansion coefficient matching silicon, are considered to be ideal materials for a new generation of highly integrated semiconductor substrates and electronic device packaging and are widely used at home and abroad attention. Prime Features: High thermal conductivity Excellent thermal shock resistance Excellent insulation, >15KV / mm Plasma etching resistance Good shock resistance Non-toxic Excellent mechanical properties Application: IC packaging IC Components for semiconductor equipment Thermal module substrate High power transistor module substrate High-frequency device substrate Exothermic insulation board for Thyristor Modules Semiconductor laser, the fixed substrate for light-emitting diode(LED) Hybrid integrated module, ignition device module INNOVACERA has ALN substrate, ALN metalized part, ALN structural parts, dry pressed tablets, if you would like to know more, pls feel free to contact us.

Best comprehensive performance ceramic – Silicon Nitride Ceramic

Silicon nitride ceramic has good properties such as high strength, high hardness, and high temperature resistance, and its hardness can reach HRA91~93; It has good thermal hardness and can withstand high temperatures of 1300~1400℃; It has a small chemical reaction with carbon and metal elements, resulting in its friction coefficient Low; It is self-lubricating which make it wear-resistant; It is strong corrosion resistance, except for hydrofluoric acid, it does not react with other inorganic acids, and has oxidation resistance at high temperatures; it also has good thermal shock resistance. It will not break even if it is rapidly cooled in the air and then heated rapidly; the high temperature creep of silicon nitride ceramics is small, and the slow plastic deformation produced under the action of high temperature and fixed load is small. In addition, silicon nitride ceramics also have the advantages of high specific strength, high specific mode, high thermal conductivity, and excellent electrical properties. Therefore, it has special application value in extreme environments such as high temperature, high speed, and strong corrosive media. It is considered as one of the structural ceramic materials with development and application prospects. It is often the first choice in many applications that...

Industrial Application And Properties Of Aluminum Nitride Ceramics

What is aluminum nitride (AlN)? Aluminum nitride (AlN) is an interesting material. If high thermal conductivity is required, it is one of the best materials. Combined with its excellent electrical insulation, aluminum nitride is an ideal radiator material for many electrical and electronic applications. Characteristics of aluminum nitride Aluminum nitride is a (mainly) covalently bonded material with a hexagonal crystal structure, which is isomorphic with one of the polytype zinc sulfides called wurtzite. The space group of this structure is P63mc. The material is stable at very high temperatures in an inert atmosphere. In the air, surface oxidation occurs above 700°C, and a surface oxide layer of 5-10nm is detected even at room temperature. This oxide layer protects the material at temperatures up to 1370°C. Above this temperature, bulk oxidation will occur. Aluminum nitride is stable in hydrogen and carbon dioxide atmospheres up to 980°C. The material is slowly dissolved in inorganic acid by grain boundary erosion and dissolved in strong alkali by erosion of aluminum nitride grains. The material is slowly hydrolyzed in water. Aluminum nitride is resistant to most molten salts, including chloride and cryolite. Aluminum nitride is synthesized by carbothermal reduction of alumina or direct nitridation of...

Do you know the five major applications of silicon nitride ceramics?

Silicon nitride ceramics have high temperature resistance, corrosion resistance, wear resistance, and unique electrical properties and are considered one of the most promising high-temperature structural ceramic materials. Aircraft engine The mechanical structure of the future aero engine will be simpler than the existing type, with fewer components, and operating at a higher turbine inlet temperature and component load. Its reliability and component life will also be improved. Turbine materials must meet the requirements in terms of tensile strength, creep resistance, high temperature corrosion resistance, and impact damage resistance. The use of ceramic materials with better thermal performance can reduce the amount of cooling air required and significantly increase the gas temperature. In the past, large aircraft engines mainly used nickel-based high-temperature materials, and silicon nitride materials have higher strength, better creep strength, and oxidation resistance than nickel-based heat-resistant alloys at temperatures above 1000°C and have a small specific gravity. It is only 40% of the heat-resistant alloy, which can meet future aviation engines' requirements to reduce weight and fuel consumption. Mechanical industry Silicon nitride ceramics can be used as turbine blades, mechanical seal rings, high-temperature bearings, high-speed cutting tools, permanent molds, etc. in the machinery industry. Many devices in the...

New Inorganic Material – Aluminum nitride (AlN) ceramics

The main crystal phase of aluminium nitride ceramics is aluminium nitride powder, which has the following characteristics: 1. What is aluminum nitride? Aluminium Nitride (AIN) is one kind has the six-party wurtzite structure form of refractory compounds The colour is grey Aluminium nitride crystals are covalently bonded compounds with Warzite structure based on [AIN4] tetrahedral structure The density of 3.26 g/cm3 Lattice constant a = 3.11, c = 4.980 The decomposition temperature is 2480℃ under normal pressure Advantages of aluminum nitride ceramic materials: The strength of room temperature is high and decreases slowly with the increase of temperature It has a high thermal conductivity Low dielectric constant and dielectric loss Low coefficient of thermal expansion Good chemical stability and non-toxic 2. Preparation of aluminium nitride powder The excellent properties of Aluminum nitride ceramics are based on the high quality of their powders. There are many methods to prepare aluminium nitrite powder, such as direct nitridation, carbide reduction process, energetic ball milling, Self-propagating high-temperature synthesis, in situ autoreactive syntheses, plasma chemical synthesis, chemical vapour deposition method, solvothermal method and organic salt cracking. 3. Forming process of Aluminum nitride ceramic Aluminium nitride ceramic formin process mainly includes: dry forming and wet forming. 1) Dry Formingis suitable for products with simple shapes and high cost, including the following two moulding methods: Ordinary die forming Cold isostatic forming 2) Wet Formingis suitable...
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