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Q&A about aluminum nitride

1. Different applications in general * High brightness high power LED * Microwave wireless communication and semiconductor equipment * Automobile * Energy * IGBT Module * IPM Module 2. Do you have some references for the different applications? We don't have detailed information. With the development of the electric components, smaller but better performance and lower energy cost elements are pressing demand. The high dense, high power and a high-frequency component may generate as much as 100W/cm2 heat, such as high bright LED, MOSFET, IGBT and laser elements. The longer those elements work, the more heat accumulated. Due to the limited room in the package, if the heat could not have been diffused in time, it would highly affect the elements’life, performance and reliability. So, it is important to introduce good cooling package design and high thermal conductivity ceramic materials into these industries. 3.Can supply pictures of some products in the application? * IGBT Module * High brightness high power LED Automobile headlights; Industrial lighting; deep UV lamp; LCD background light source; Indoor agricultural lighting. * Components for semiconductor equipment 4. Do you have some standard dimensions or similar product descriptions? * ALN substrate is available in regular sizes Substrate...

Silicon Nitride Ceramic Substrate for Electronics

INNOVACERA Silicon Nitride substrates, with a thermal conductivity rating of 90 Watts/meter Kelvin, at first glance, appear inferior to Aluminum Nitride grades from the standpoint of heat dissipation. However, Silicon Nitride substrates, due to their far superior mechanical properties, can provide thermal resistance levels comparable to Aluminum Nitride. This is because Silicon Nitride substrates have twice the strength and fracture toughness of Aluminum Nitride substrates, which enable the circuit/package designer to use Silicon Nitride substrates that can be half as thick as Aluminum Nitride substrates. These same impressive mechanical properties also make Silicon Nitride substrates an excellent choice in applications where severe, repetitive thermal cycling of the circuit/package is present.

Aluminum Nitride Ceramic

Aluminum nitride (AlN) is a technical ceramic material that features an extremely interesting combination of very high thermal conductivity and excellent electrical insulation properties. It has a hexagonal crystal structure and is a covalent bonded material. The use of sintering aids and hot pressing is required to produce a dense technical grade material. The material is stable to very high temperatures in inert atmospheres. In air, surface oxidation begins above 700°C. A layer of aluminum oxide forms which protects the material up to 1370°C. Above this temperature bulk oxidation occurs. Aluminum nitride is stable in hydrogen and carbon dioxide atmospheres up to 980°C. The material dissolves slowly in mineral acids through grain boundary attack, and in strong alkalis through attack on the aluminum nitride grains. The material hydrolyzes slowly in water. Most current applications are in the electronics area where heat removal is important. This material is of interest as a non-toxic alternative to beryllia. Metallization methods are available to allow AlN to be used in place of alumina and BeO for many electronic applications. Properties Good dielectric properties High thermal conductivity Low thermal expansion coefficient, close to that of Silicon Non-reactive with normal semiconductor process chemicals and gases Application Substrates...

Centorr Vacuum Industries Sells Two High-Temperature Furnaces for Aluminum Nitride Production

Centorr Vacuum Industries announced it has shipped orders for two high-temperature sintering furnaces for 2015 delivery to a leading firm in the production of AlN substrates for the LED market in China. The designs include CVI's 2 cu ft graphite furnace for AlN sintering and a refractory metal furnace rated to 1850C for a secondary heating process. These new furnaces build on the success of CVI's experience in non-oxide ceramics and include modifications made specifically for high-temperature sintering of advanced ceramics. Centorr's graphite furnace design includes robust Graphite Tube and Block elements designed for use to 2250°C, with a 4-sided hot zone and integral graphite retort for excellent temperature uniformity. The rigid graphite insulation design provides for long-term service even in the presence of process off-gassing and residual binder contamination, while the new dual-flow Sweepgas® system allows more effective "sweeping" away of the process offgassing. Furnace control is via PLC/Programmable Controllers with Centorr's custom-designed HMI visualization interface. Centorr Vacuum Industries Sintervac Non-Oxide design is available in sizes of 2,3,4.5,9,16,24, and 54 cubic foot volumes. The refractory metal furnace design, sized at 1 cu ft will be used for a specific part of the AlN process where a non-graphite hot zone...

What kind of heating element can have a built-in K-type thermocouple?

INNOVACERA recently launched a small aluminum nitride ceramic heating element. Made of aluminum nitride ceramic with high thermal conductivity. Has excellent heat dissipation and electrical insulation properties. With its properties of electrical insulation and excellent thermal conductivity, Aluminum Nitride Ceramics is ideal for applications where heat dissipation is required. In addition, since it offers a coefficient of thermal expansion (CTE) near that of silicon, and excellent plasma resistance, it is used for semiconductor processing equipment components. Small Aluminum Nitride Ceramic Heating Element Characteristics The heater can have a built-in K-type thermocouple, so it has good temperature sensing characteristics, improves its responsiveness to rapid heating and cooling, and can be used safely. Fast heating and cooling The aluminum nitride substrate with high thermal conductivity can be used to achieve rapid heating and cooling, and the thermal expansion rate can be used according to the material properties to design under high power density, so it can also be used for rapid heating and cooling (both 150℃/ sec) temperature cycle. Excellent electrical performance Excellent insulation and voltage resistance at high temperatures Small Aluminum Nitride Ceramic Heating Element Features Thermal properties Physical properties Electrical characteristics Thermal conductivity 150(W/mK) Density 3.2(g/cm3) Voltage 12V~240V Thermal expansion...

A brief introduction to HTCC

What is HTCC HTCC (High Temperature co-fired Ceramic) adopts tungsten, molybdenum, molybdenum, manganese, and other High melting point metal heat resistance paste printed on 92 ~ 96% alumina flow Ceramic green billet according to the design requirements of heat circuit, 4 ~ 8% sintering agent and then laminated multilayer. In 1500 ~ 1600°C under high temperature burning into a whole. Therefore, it has the advantages of corrosion resistance, high temperature resistance, long life, high efficiency and energy saving, uniform temperature, good thermal conductivity, fast thermal compensation, and does not contain lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl, polybrominated diphenyl ethers, and other harmful substances, in line with the European Union RoHS environmental protection requirements. Due to the high firing temperature, HTCC cannot use gold, silver, copper and other low melting point metal materials, must use tungsten, molybdenum, manganese, and other refractory metal materials, these materials have low conductivity and will cause signal delay and other defects, so it is not suitable for high-speed or high-frequency microassembly circuit substrate. However, HTCC substrate has the advantages of high structural strength, high thermal conductivity, good chemical stability, and high wiring density, so it has a wide application prospect in high-power microasse. The classification...

China’s industrial ceramics industry market analysis

The Chinese government has included industrial ceramics in these new materials industry in the 13th Five-Year National strategic development plan. The new materials industry is one of the seven strategic emerging industries in China and one of the ten key development areas of Made in China 2025. The Chinese government has established an insurance compensation mechanism for the first time, and pilot work has been carried out on a number of new materials. Enterprises using the first batch of new materials are the beneficiaries of insurance. It aims to make institutional arrangements for the risk control and sharing of the application of new materials by means of insurance, break through the market bottleneck of the initial application of new materials, and activate the effective demand of the downstream industry for new materials products. In addition, local governments at all levels have also issued policies to support the development of the industrial ceramics industry, increase support for the construction of an advanced ceramic industry chain, and open public service platforms to support industrial ceramics material cooperation projects and achievement of transformation projects, which will promote the rapid development of industrial ceramics industry. It is expected that by 2025, the market value...

TO 247 Ceramic Insulating Sheet

 TO-247 Ceramic Insulating Sheets by Innovacera have been developed to offer better thermal management in discrete semiconductor technologies like MOSFETs, IGBTs, and Power Transistors. As a silicone-based interface solution, this one uses more modern ceramics, Alumina (Al₂O₃), and Aluminum Nitride (AlN) which come in two different grades: one with 3.7mm cooling windows and another without any perforations. These ceramic substrates insulate electric currents very well, and at the same time, get rid of heat in power electronic assemblies. If you need related products or customization, please contact us.
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