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INNOVACERA Will Attend The SEMICON Europa 2023

Mostly Every year Innovacera attends an international trade show for technical ceramic solutions and electronics, optical, and semiconductor manufacturing industry. Due to the COVID-19 pandemic, Innovacera long time didn’t take a part in the international trade show, so this 2023 year, we are delighted to announce our participation as an exhibitor in Semicon Europa 2023 and ACE 2023. Welcome to join us at booth #B2-664 in Semicon Europa 2023. Visit our booth B2-664 and learn more about the innovative technical ceramic components and technical ceramic solutions from Innovacera for semiconductor Industry applications. From the product of Metallized Ceramics, Ceramic Carrier Plates, Ceramic Separation Ring, Ceramic Robotic Arm End Effectors, Ceramic Heaters, Ceramic Substrates, Ceramic Bases, Ceramic Shells, Ceramic Reflector Cavities, AMB Silicon Nitride Substrate, DBC, DPC, ceramic welding parts and material of Boron Nitride Ceramic, Pyrolytic boron nitride, Aluminum Nitride, Alumina Ceramic, Zirconia Ceramic, Porous Ceramic, Silicon Nitride Ceramics, Beryllia Ceramics, Machinable Glass Ceramic, Silicon Carbide Ceramics. We offer you a wide range of advanced ceramic components for semiconductor manufacturing. SEMICON Europa 2023  co-located with productronica 2023 Date: Nov 14–17, 2023 Innovacera Booth No.:  B2664 Address: Neue Messe München, Munich, Germany Scale:  more than 130 exhibitors and attracted over 3,500 attendees from 54 countries. Organizer: SEMICON Europa,...

The Three Most Commonly Used Ceramic Materials For Pcbs

Due to the properties of ceramics, ceramic PCBs can be placed in high-pressure or high-temperature environments, traditional PCB substrate materials may exhibit flaws in extreme conditions. In the article, we will discuss three common ceramic PCBs. The three most commonly used ceramic materials for PCB manufacturing are: Alumina (Al2O3) - The mechanical strength, chemical stability, thermal conductivity, and electrical properties of Al2O3 is advantageous compared to other oxide ceramics. The abundance of a raw material makes alumina the most commonly used ceramic substrate material. Al2O3 ceramic PCBs are used in automobile sensor circuits, shock absorbers, and engines. The high thermal stability of Al2O3 ceramic PCBs improves the performance and thermal efficiency of the circuits used in automobiles. Aluminum Nitride (AlN) - The high thermal conductivity and coefficient of expansion are two properties that make AlN noteworthy as a substrate material in the PCB industry. The thermal conductivity of AlN varies in the range of 170 W/mK to 220W/mK. The CTE of AlN ceramic matches with silicon semiconductor chips, which establishes a good bonding between the two, thus making their assembly reliable. AIN is used in sensor circuits in automobiles, as it can withstand extreme temperatures, corrosion, and vibration while providing...

Technical Ceramic Components Work In Semiconductor Industry

Technical Ceramic Components are integral to semiconductor manufacturing equipment, technical ceramic components are high in purity with low levels of trace metals, this means they can constitute either the process chamber material or interior process surfaces for CVD, PVD, plasma etching, and ion implanting where their strong dielectric properties are highly beneficial, so it is widely used in the semiconductor industry. The semiconductor industry uses advanced technical ceramics including alumina ceramic (AL2O3), aluminum nitride (ALN), Porous Ceramic, Boron Nitride (BN), pyrolytic boron nitride (PBN), and silicon carbide (SiC). PBN has primarily been used for crucibles in metal oxide (MOCVD) deposition tools, the mainly single crystal growth methods are LEC and VGF, so PBN LEC and VGF crucibles are required. PBN molecular beam epitaxy (MBE) crucibles are one of the most important epitaxy growth processes for group III-V and group II-VI semiconductor crystals in the world today. PBN crucible is the best container for evaporating elements and synthetic materials in this process. The PBN ring around the evaporation crucible is used in OLED equipment. More ceramic parts used for the semiconductor industry are as below: Boron nitride ceramic insulator part used for PVD and MOCVD equipment. Porous ceramics are widely used...

ALN – An Insulation High Thermal Conductivity Material

Aluminum Nitride is one of the function ceramics among all the advanced ceramics. It has very good thermal-mechanical and electrical properties: high thermal conductivity, low dielectric constant, the linear expansion coefficient matches well with silicon, good electrical insulation, low density, non-toxic, high mechanical strength, and so on. with the fast development of microelectronics, the high T/C AIN used as the base or package material has been put on more and more focus. With the development of the electric components, smaller but better performance and lower energy cost elements are of pressing demand. The high dense, high power, and high frequency component may generate as much as 100W/cm2 heat, such as High bright LED, MOSFET, IGBT, and laser elements. The longer those elements work, the more heat accumulated. Due to the limited room in the package, if the heat could not have been diffused in time, it would highly affect the elements' life, performance, and reliability. So, it is important to introduce a good cooling package design and high thermal conductivity ceramic materials into these industries. Innovacera has 4 main products: AlN substrate, AlN Structural parts, AlN dry pressed tablets, Isostatic pressed parts, and so on. If you have more interest,...
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