technical ceramic solutions

Project Tags thermal management

Direct Bonded Copper (DBC) and Direct Plated Copper (DPC) Substrates

Direct Bonded Copper (DBC) and Direct Plated Copper (DPC) substrates are key technologies in power electronics. They involve bonding a pure copper layer to a ceramic base, typically Alumina or Aluminum Nitride, providing excellent thermal dissipation and electrical insulation. These substrates are crucial for IGBT modules, power LEDs, and automotive electronics. Innovacera offers high-quality DBC and DPC substrates, enabling superior performance and reliability in high-power applications.

Aluminum Nitride Substrates for Thermal Management

Aluminum Nitride (AlN) is a premier material for thermal management in high-power electronics due to its exceptional thermal conductivity and high electrical resistivity. AlN substrates are essential for components like high-power LEDs, laser diodes, and power modules, where efficient heat dissipation is critical for performance and reliability. Innovacera manufactures high-purity, hot-pressed Aluminum Nitride substrates and thermal pads, offering superior solutions for the most demanding thermal challenges in modern electronics.
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