Alumina Ceramic Metallization Disc with 3 Holes for TO Package

Alumina ceramic metallization discs, designed with 3 holes, were typically used in TO (Transistor Outline) packages. Providing the hermetic sealing, electrical insulation, and thermal stability in strict condition for high-reliability electronic packaging.

Product Overview
Alumina ceramic metallization is the process of applying molybdenum-manganese (Mo-Mn) then coating with Nickel on ceramics, bonding both the mechanical and electrical properties of ceramics and metals together. These three through-holes are to accommodate metal feedthrough pins, allowing for electrical interconnection while maintaining hermetic isolation. The metallized alumina disc forms the insulation base for TO packages like TO-3, TO-5, TO-8, TO-39, etc.

Application Areas
-TO Packages (e.g., TO-3, TO-5, TO-8, TO-39)
-Power semiconductor devices
-Laser diodes and optoelectronic packaging
-RF and microwave device packaging
-High-reliability and hermetically sealed sensors
-Telecommunications and optical components
-Medical, military, and aerospace electronics

Technical Advantages
-High Electrical Insulation: Alumina ceramic provides excellent dielectric properties, is an ideal material for isolating signal paths.
-Hermetic Sealing: By using brazing or soldering techniques, the ceramic discs insulated between metal leads and TO package body, which enables the integration of metal pins through the disc.
-Hermeticity: Provides leak-tight seals in vacuum or demanded environments.
-Thermal Stability: Maintains mechanical and electrical performance under high thermal stress.
-Corrosion Resistance: The metallization layer can help to prevent oxidation, ensuring long-term reliability.
-Mechanical Strength: Suitable for rugged operating conditions such as vibration and thermal cycling.

Alumina ceramic metallization discs are critical components in TO packaging, it can provide the high performance between metal and ceramic for hermetical sealing. Continuous innovation in metallization and brazing techniques will further enhance their application in emerging electronic technologies.